C&C is exhibiting at the "Hong Kong International Printing & Packaging Fair 2014" at Booth 3-B10, Hall 3 during 27-30 April 2014. Mr. YEUNG Kam Kai, Life Honorary President of The Hong Kong Printers Association (HKPA), visited C&C’s booth on the 1st day of the Fair. Mr. Jackson LEUNG, Vice-Chairman of HKPA and CEO of C&C, hosted the visit and introduced C&C’s Smart Packaging Solutions.

Mr. Jackson LEUNG, Vice-Chairman of HKPA and CEO of C&C, hosted the visit of Mr. YEUNG Kam Kai, Life Honorary President of The Hong Kong Printers Association (HKPA) in C&C’s booth.

In the Fair, C&C is exhibiting at the "Hong Kong International Printing & Packaging Fair 2014" at Booth 3-B10, Hall 3, demonstrating the implementation of smart packaging design concept with Augmented Reality (AR), Radio Frequency Identification (RFID), UV Printing and Security printing, for better brand promotion and protection, and product tracking.